BGT Backside Grinding Tape
Backside Grinding Tape
Backside Grinding Tape
Material which protects the wafer surface during back grinding

BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties.

Product inquiry
Product functions
· Easy removal after back grinding process
· Protects wafer pattern surface and prevents damages to edges
· Warpage minimization
· Stable processability
Product structure
BGT-ST : PU FilmUV, Curable PSA, PET Film
BGT-ST : PU FilmUV, Curable PSA, PET Film
Product Classification
Product Classification :Category ,Grade ,Features ,Applications ,Download
Category Grade Features Applications Download
BGT
BGT-ST
* Thickness (μm) : 150 ~ 200 * Low warpage and burr&residue-free
Standard type
BGT
BGT-TD
* Thickness (μm) : 100~ 150 * High Shear Strength (Low Die-shift)
For GAL/DBG processes
BGT
BGT-BU
* Thickness(μm) : 200 ~ 350 * Excellent bump adhesion
For bumps